Recruitment

Job Name
Number of recruits
Work Place
Date
Failure Analysis Engineer
1
Shenzhen
2021/10/26
Job Responsibilities:

1. Analyze the failure causes of components and other electronic related products according to the customer's application.

2. Develop new test items, analyze customer test requirements, and implement various tests in accordance with test requirements and relevant standards and specifications.

3. Do a good job of quality control in the areas under its jurisdiction.

4. Maintain technical communication with internal and external customers and provide good technical support services.

5. Cultivate newcomers in the technical field in charge.

Qualifications:

1. Bachelor degree or above, major in materials and electronics;

2. More than 3 years of experience in failure analysis of electronic components, PCB or PCBA;

3. Familiar with the operation of transistor graphic instrument, resistance-capacitance original, high resistance instrument, breakdown voltage tester, X-ray, C-sam and other electrical performance related analysis instruments;

IC Analysis Engineer
1
Shenzhen
2021/10/26
Job Responsibilities:

1. Responsible for IC related failure analysis and writing report;

2. Assist in board-level circuit analysis and confirm device problems;

3. Maintenance and use of laboratory test equipment;

4. Follow up and complete customer needs and assist customers in improving;

Qualifications:

1. Follow up and complete customer needs and assist customers in improving;

2. Major in microelectronics or electronics or materials, with good analog/digital electronics foundation, PCBA circuit analysis ability is preferred;

3. Familiar with the working principles and basic applications of integrated circuits, experience in integrated circuit packaging technology or certain types of device technology or quality management is preferred;

4. Proficiency in using various electronic device analysis and test equipment, such as oscilloscope, transistor test, X-Ray, CSAM, slice, SEM/EDS, EMMI, FIB and other analysis methods;

5. CET-4 and above, can write English reports proficiently;

Electronic Component Engineer
1
Shenzhen
2021/10/26
Job Responsibilities:

1. Assist in the inspection and analysis of integrated circuits/electronic components and write reports;

2. Responsible for the electrical performance testing of electronic components;

3. Maintenance and use of laboratory test equipment;

4. Follow up and complete customer needs and assist customers in improving;

Qualifications:

1. Bachelor's degree / college degree or more than 3 years of work experience, DPA analysis experience is preferred;

2. Major in microelectronics or electronics or materials, with good analog/digital electronics foundation;

3. Proficiency in using various electronic device analysis and testing equipment, such as oscilloscope, transistor test, parameter tester, X-Ray, CSAM, slice, SEM/EDS and other analysis methods;

4. CET-4 and above, can write English reports proficiently.

Chip Test Engineer
1
Shenzhen
2021/10/26
Job Responsibilities:

1. Develop a test plan according to the chip specifications;

2. Responsible for writing test cases and performance simulation in the chip design stage;

3. Responsible for proposing chip Demo board and basic software development task book;

Qualifications:

1. Bachelor degree or above, major in electronics, communication, computer, etc.;

2. Familiar with the development and debugging of embedded boards containing CPU, DSP and FPGA chips;

AE Engineer
1
Shenzhen
2021/10/26
Job Responsibilities:

1. Familiar with ATE test;

2. Planning the new product production test plan, formulating test plans, test cases, and testing the introduction and erection of the new platform;

3. Have a certain understanding of analog and digital chips, and conduct an evaluation plan and implement it according to the test plan formulated by the customer;

Qualifications:

1. Microelectronics/electrical engineering or related majors, familiar with basic knowledge of image simulation and digital circuits;

2. Preference is given to those who have experience in image integrated circuit performance testing, evaluation and testing;